Blechexpo

International Trade Fair for Sheet Metal Working

5 - 8 November 2013, Stuttgart, Germany

The practical trade fair duo of Blechexpo and Schweisstec takes place on a two-year cycle in the state trade fair centre in Stuttgart (Landesmesse Stuttgart) and is the only event in the world that deals with the complementary technologies of sheet metal processing and joining technology. Within the shortest timeframe, Blechexpo has been able to gain a leading position in Europe and now ranks second in the world on the list of trade fairs for sheet metal processing. The Schweisstec international specialist trade fair for joining technology forms the ideal complement. It presents all of the relevant mechanical and thermal joining and connecting procedures as well as thermal welding processes.

The great and continuing success of the Blechexpo/Schweisstec trade fair group is due not least to its consistent focus as a meeting place for the industry in the primary European market. Based in the heart of industrial Europe, the large consumer and user market is a real “benchmark” for the manufacturers of products, machines, systems and accessories in hard and software for sheet metal component production from small scale to highly industrial.

With well over 1,000 exhibitors from more than 30 countries and a gross exhibition space of 70,000 m², the complementary Blechexpo and SchweissStec specialist trade fairs stand out on all levels. The trade fair duo now attracts around 26,000 specialist visitors from nearly 90 states to the Stuttgart trade fair centre (figures from 2011). The manufacturers are in agreement that Blechexpo offers the ideal platform to reach their target groups. This view is also shared by welding technology and power tool suppliers, completing the process chain for users from all industries and on all scales.

Please visit our exhibition booth in hall 4, booth no 4501.

Sub-exhibitor is the company UBECO GmbH (please find fnformation to UBECO here).

Please find more information to BlechExpo fair here.